PCB Multiprotocol Modules

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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

Reel
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter, 4MB Flash, PCB antenna
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 105C, 2MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

Reel
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter, 2MB Flash, PCB antenna
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna, 8MB Flash, PCB antenna Non-Stocked
Min.: 250
Mult.: 250
: 250

2.4 GHz, 5 GHz PCB Reel
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna, 4MB Flash, PCB antenna Non-Stocked
Min.: 250
Mult.: 250
: 250

2.4 GHz, 5 GHz PCB Reel
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

Reel
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: PCB, -40 85C, 8MB flash
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500

2.4 GHz ADC, GPIO, I2C, I2S, PWM, SPI, UART, 3 V 3.6 V 25.5 mm x 18 mm x 3.2 mm Bluetooth 5.1 802.11 b/g/n/ax Reel
Quectel Multiprotocol Modules 5G R17 Redcap, 5G SA only, LTE CAT4, LGA package, Global version (newer PCB revision)
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 250
Mult.: 250
: 250
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Reel
Quectel Multiprotocol Modules 5G R17 Redcap, 5G SA only, LTE CAT4, miniPCIe FF, Global version (newer PCB revision)
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Tray
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel BG95M9LATEA-64-SGNS
Quectel Multiprotocol Modules Embedded, 600-960, 1427.9-1495.9, 1710-2170, 2300-2700 , LTE (4G) , PCB with cable, 75 +/-3 , RF1, Adhesive, 50 25 0.85
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel Multiprotocol Modules Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz I2C, SPI 3.14 V 3.46 V - 40 C + 85 C 25.5 mm × 18 mm × 3.16 mm Reel
Quectel FCM362KAAMD-0P-04
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna: PCB, 4MB Flash Non-Stocked Lead-Time 20 Weeks
Min.: 500
Mult.: 250
: 250
2.4 GHz, 5 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.15 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset.
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Reel
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEBE-SMT-SP is a Wi-Fi 7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases for e
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Bulk
Quectel Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi & Bluetooth application: USB 2.0, -40C +85C
Datasheet
Non-Stocked Lead-Time 32 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
u-blox Multiprotocol Modules LTE Cat M1, NB2, 2G module w GNSS Secure cloud and GNSS, Band configurable LGA, 16x26 mm, 250 pcs/reel
Datasheet
2,098In Stock
Min.: 1
Mult.: 1
: 250

SARA-R4 2.1 GHz 33 dBm I2C, UART 3.8 V 3.8 V - 20 C + 65 C 26 mm x 16 mm x 2.12 mm LTE GPS, GLONASS, Galileo Reel, Cut Tape