SMD/SMT Multiprotocol Modules

Results: 349
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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Ezurio Multiprotocol Modules Sterling LWB+, MHF4, Tape and Reel
Datasheet
1,500Expected 1/5/2027
Min.: 1
Mult.: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio Multiprotocol Modules Module, Sona IF513, Antenna Diversity, M.2, Key E, SDIO, UART
Datasheet
175Expected 8/17/2026
Min.: 1
Mult.: 1

Sona IF513 2.4 GHz, 5 GHz, 6 GHz 17 dBm SDIO, UART 3.13 V 3.5 V - 40 C + 85 C MHF4L 30 mm x 22 mm x 3.1 mm Bluetooth 5.4, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio Multiprotocol Modules Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
Datasheet
1,544Expected 12/2/2026
Min.: 1
Mult.: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotocol Modules Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
Datasheet
1,000Expected 11/5/2026
Min.: 1
Mult.: 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Kaga FEI Multiprotocol Modules WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
Datasheet
300Expected 11/26/2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Multiprotocol Modules WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
Datasheet
300Expected 11/26/2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
Datasheet
800Expected 11/20/2026
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
Datasheet
800Expected 1/1/2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
Datasheet
800Expected 1/1/2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Multiprotocol Modules Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
Datasheet
250Expected 10/12/2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotocol Modules Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
Datasheet
750Expected 12/31/2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotocol Modules IW611, 802.11ax+BT, 2 antenna pins
Datasheet
1,000Expected 8/17/2026
Min.: 1
Mult.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotocol Modules Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
Datasheet
500Expected 12/31/2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
500Expected 8/10/2026
Min.: 1
Mult.: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments Multiprotocol Modules SimpleLink multipro tocol 2.4-GHz wirele
Datasheet
Lead-Time 26 Weeks
MouseReel Available
Min.: 1
Mult.: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Multiprotocol Modules SimpleLink multipro tocol 2.4-GHz wirele
Datasheet
232In Stock
MouseReel Available
Min.: 1
Mult.: 1
: 2,000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
1,070Expected 9/4/2026
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotocol Modules SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
Datasheet
200On Order
Min.: 1
Mult.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
150Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
25Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
50Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
50Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
100Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
50Expected 8/6/2026
Min.: 1
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Advantech Multiprotocol Modules Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, LGA 1620 (Wi-Fi: PCIe/BT:USB)
Datasheet
7Expected 10/12/2026
Min.: 1
Mult.: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7