UCC23513EVM-014

Texas Instruments
595-UCC23513EVM-014
UCC23513EVM-014

Fabricante:

Descripción:
Herramientas de desarrollo de administración de IC UCC23513EVM-014

En existencias: 6

Existencias:
6 Se puede enviar inmediatamente
Plazo de entrega de fábrica:
12 Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$58.81 $58.81

Atributo del producto Valor de atributo Seleccionar atributo
Texas Instruments
Categoría de producto: Herramientas de desarrollo de administración de IC
RoHS:
Evaluation Modules
Gate Driver
35 V
UCC23513
UCC23513-014
Marca: Texas Instruments
Tipo de producto: Power Management IC Development Tools
Cantidad de empaque de fábrica: 1
Subcategoría: Development Tools
Peso de la unidad: 136.080 g
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Atributos seleccionados: 0

CNHTS:
8543909000
USHTS:
8473301180
TARIC:
8473302000
ECCN:
EAR99

Motor Control Solutions

Texas Instruments Motor Control Solutions leverage TI's rich history in advanced motor control expertise, combined with TI's analog and embedded processing portfolios, to deliver complete motor system solutions. TI provides a broad motor expertise, a wide breadth of selection, and comprehensive support for efficient, reliable, and cost-effective drive and control solutions.

UCC23513EVM-014 Gate Driver Evaluation Module

Texas Instruments UCC23513EVM-014 Gate Driver Evaluation Module (EVM) is designed to evaluate TI's 5kVRMS isolated single-channel gate driver with opto-compatible input, UCC23513. The input is current driven, requiring between 7mA and 16mA for device turn-on, and can be reverse biased for the turn-off. The device can have a 4A source and 5A sink peak output current for driving Si MOSFETs, IGBTs, and WBG devices, i.e., SiC and GaN transistors. The Texas Instruments UCC23513EVM-014 is populated with clips and 2-position headers for flexibility in connecting power and signal inputs, along with signal test points and large GND vias to enable the installation of ground springs. The PCB layout is optimized with a minimal loop area in the input and output paths. It showcases a high-voltage design between the primary and secondary sides with 8mm creepage.