XR-C452-0404C

Quantic X-Microwave
433-XR-C452-0404C
XR-C452-0404C

Fabricante:

Descripción:
Herramientas de desarrollo RF Band Pass Filters, B100MC5SSMT

Ciclo de vida:
Nuevo en Mouser

Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$374.28 $374.28

Embalaje alternativo

N.º de artículo del Fabricante:
Embalaje:
Poly Bags
Disponibilidad:
En existencias
Precio:
$271.47
Mín.:
1

Atributo del producto Valor de atributo Seleccionar atributo
Quantic X-Microwave
Categoría de producto: Herramientas de desarrollo RF
RoHS:  
Bandpass Filters
Band Pass Filter
Marca: Quantic X-Microwave
Empaquetado: Poly Bags
Tipo de producto: RF Development Tools
Serie: C452
Cantidad de empaque de fábrica: 1
Subcategoría: Development Tools
Alias de las piezas n.º: B100MC5S
Productos encontrados:
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Atributos seleccionados: 0

USHTS:
8548000000

Diplexers & Filters

Quantic X-Microwave Diplexers and Filters provide RF and microwave industry modular design technology. The Quantic X-Microwave Diplexers and Filters use X-MWblock® modular building blocks, so engineers can quickly prototype and build efficient, cost-effective systems. Applications include wireless infrastructure, radar, navigation, transportation, quantum computing, medical devices, and test/measurement. These solutions support components from manufacturers like Akoustis, Analog Devices, Atlanta Micro, CTS, Knowles/DLI, Kyocera AVX, Marki Microwave, Microchip/Vectron, Mini-Circuits, Qorvo, Quantic X-Microwave, and TDK.

Get On The Grid

Quantic X-Microwave Get On The Grid is part of the X-Microwave System for RF and Microwave design. X-MWblocks revolutionize RF signal chain optimization with drop-in flexibility, negating the need for soldering or cumbersome evaluation board connections. These blocks are complemented by programming tools like the Raspberry Pi Controller, streamlining the design process. The X-MWblocks can be effortlessly moved from prototype plates into standard or custom connectorized housings, eliminating the need for solderless interconnects. The devices can be incorporated into a single PCB for more integrated solutions, replacing spring pins with soldered wires. Miniaturization is also an option, ensuring compatibility with other grid modules.