180-M78-103L001

NorComp
636-180-M78-103L001
180-M78-103L001

Fabricante:

Descripción:
Conectores de alta densidad subminiatura D 78HD M SC No HW

Modelo ECAD:
Descargue Library Loader gratis para convertir este archivo para su herramienta ECAD. Conozca más sobre el modelo ECAD.

En existencias: 2

Existencias:
2
Se puede enviar inmediatamente
En pedido:
40
Se espera el 19/6/2026
Plazo de entrega de fábrica:
19
Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$21.63 $21.63
$18.39 $183.90
$16.67 $416.75
$15.87 $634.80
$15.42 $1,850.40
$14.53 $4,068.40
$13.91 $7,233.20

Atributo del producto Valor de atributo Seleccionar atributo
NorComp
Categoría de producto: Conectores de alta densidad subminiatura D
RoHS:  
78 Position
4 Row
Male
Solder Cup
Vertical
Gold
3 A
180
Tray
Marca: NorComp
Material del contacto: Brass
Tipo de contacto: Machined Contacts
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: TW
Aislamiento: Insulated
Material de aislamiento: Polybutylene Terephthalate (PBT)
Temperatura de trabajo máxima: + 125 C
Temperatura de trabajo mínima: - 55 C
Estilo de montaje: Wire
Paso: 2.41 mm
Tipo de producto: High Density D-Sub Connectors
Material de la cubierta: Steel
Revestimiento de la carcasa: Nickel
Cantidad de empaque de fábrica: 40
Subcategoría: D-Sub Connectors
Productos encontrados:
Para mostrar productos similares, seleccione al menos una casilla de verificación
Seleccione al menos una de las casillas de verificación anteriores para mostrar productos similares en esta categoría.
Atributos seleccionados: 0

Esta funcionalidad requiere que JavaScript esté habilitado.

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

Solder Cup High-Density D-Sub Connectors

NorComp Solder Cup High-Density D-Sub Connectors come in 4 industry sizes/positions: 15-pin, 26-pin, 44-pin, and 62-pin. These connectors' metal shells provide EMI/RFI shielding in 3 clinch-nut options. There are approximately 65% more higher-density connectors than standard d-sub connectors in the Solder Cup High-Density connectors and screw machined contacts offer high reliability. NorComp Solder Cup High-Densicty D-Sub Connectors' plug shells have indents to provide grounding and additional retention. These connectors will fit in standard D-sub backshells, and contacts will accept (28-24) gauge wire.

High Density D-Sub Connectors

NorComp High Density D-Sub Connectors are available in cable and board mount options. Cable mount options include crimp and solder cup and the board mount options include Dip Solder, Wire Wrap, High Profile, Right Angle, & Surface Mount (SMT). This comprehensive NorComp High Density Density D-Sub product offering is available in both stamped & formed and machined contact options.

D-Sub Solutions

NorComp D-Sub Solutions offer a broad range of higher reliability D-Sub connectors, backshells, and hoods. NorComp's D-Sub product line is designed for applications that require a rugged, robust I/O connector system with various styles and mounting options. All are used in multiple industries, including computer, industrial, medical, and military markets.

Telematic Connector Solutions

NorComp Telematic Connectors offer exceptional reliability and superior protection against moisture with an IP67 rating. These connectors are designed to withstand high-vibration environments, ensuring optimal performance. Suitable applications include emergency warning systems, GPS navigation, vehicle tracking, and fleet management devices. NorComp Telematic Connectors provide a secure and reliable connection that is essential for the precise reporting of telematics technology.