2910058
298-2910058
2910058
Mfr.:
Description:
Chemicals Epoxy, Heat Cure, for Circuit Board Underfill, 30ml Syringe, Eccobond UF 3832
This product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.
Chemicals Epoxy, Heat Cure, for Circuit Board Underfill, 30ml Syringe, Eccobond UF 3832
This product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.
Datasheet:
Mouser does not presently sell this product in your region.
Origin Classifications
- Country of Origin:
- United States
- Assembly Country of Origin:
- Not available
- Country of Diffusion:
- Not available
Availability
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Stock:
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Honduras
